The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Jan. 31, 2013
Seagate Technology Llc, Cupertino, CA (US);
Leping Li, Bloomington, MN (US);
Saravuth Keo, Prior Lake, MN (US);
Kara L. Maytag, Plymouth, MN (US);
Pramit P. Parikh, Eden Prairie, MN (US);
Jeff R. O'Konski, Savage, MN (US);
Mark A. Herendeen, Shakopee, MN (US);
Joel W. Hoehn, Hudson, WI (US);
Roger L. Hipwell, Eden Prairie, MN (US);
Joe J. Schobel, Lakeville, MN (US);
John L. Ibele, Minneapolis, MN (US);
Ralph Marquart, Hudson, WI (US);
Edward Knutson, Burnsville, MN (US);
Seagate Technology LLC, Cupertino, CA (US);
Abstract
The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.