This inventor holds 1 USPTO granted patent. Top assignee: Seagate Technology Incorporated. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Joe J. Schobel: Advancing Precision in Microelectronic Bonding
Introduction
Joe J. Schobel is an inventor associated with Lakeville, Minnesota, and Seagate Technology Incorporated. His patent work addresses a specialized challenge in microelectronics: forming reliable wire bonds where bonding pads are exceptionally small and closely spaced.
Latest Patents
Schobel is credited with 1 patent, titled “Ambient Temperature Ball Bond.” The invention describes systems and methods for forming a ball bond with gold wire less than one-thousandth of an inch in diameter. It uses ultrasonic bonding energy without heating the underlying bonding pad.
By avoiding pad heating and enabling a shallow-space-compatible bond, the technique is intended to support particularly small bonding pads positioned close to adjacent microelectronic structures. These constraints can make other bonding methods unsuitable when they require shallow take-off angles.
Career Highlights
Schobel’s disclosed invention focuses on precision interconnection in microelectronic devices. Its ambient-temperature approach and use of very fine gold wire address the practical demands of bonding in densely arranged electronic structures.
Collaborations
Schobel’s listed coworkers include Roger L. Hipwell and John L. Ibele. The available information identifies them as coworkers but does not specify their roles in developing the patent.
Conclusion
Joe J. Schobel’s patent highlights a targeted innovation in microelectronic assembly, offering a method for forming fine-wire ball bonds without heating the bonding pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile