Palm Bay, FL, United States of America

Ralph D DiStefano

This inventor holds 6 USPTO granted patents. Top assignee: Harris Corporation. Active years: 1985-1993.


% Patents Active = 100.0

Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1985-1993

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6 patents (USPTO):Explore Patents

Title: Ralph D. DiStefano: Innovator in Waffleline Technology

Introduction

Ralph D. DiStefano is a notable inventor based in Palm Bay, FL (US). He has made significant contributions to the field of RF waffleline technology, holding a total of 6 patents. His innovative approaches have paved the way for advancements in flexible and lightweight interconnect structures.

Latest Patents

DiStefano's latest patents include a method for creating a lightweight, flexible waffleline interconnect structure. This method involves producing a negative silicone casting from a rigid metal tooling plate, followed by casting an epoxy resin or nickel electroforming. The end products are either a thin epoxy composite structure or a nickel electroform metallized with gold. Another patent focuses on an electroformed method for fabricating round mesa millimeter wave structures, which includes making holes in a substrate material, depositing layers of materials, and etching to create a Waffleline structure.

Career Highlights

Ralph D. DiStefano has had a distinguished career at Harris Corporation, where he has applied his expertise in developing innovative technologies. His work has been instrumental in advancing the capabilities of RF interconnects, making them more efficient and versatile.

Collaborations

Throughout his career, DiStefano has collaborated with talented individuals such as Marc H. Popek and James A. Sanborn. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Ralph D. DiStefano's contributions to waffleline technology exemplify his innovative spirit and dedication to advancing engineering solutions. His patents reflect a commitment to creating efficient and effective interconnect structures that have a lasting impact on the industry.

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