Brea, CA, United States of America

Rajwant Sidhu

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 1.5

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2012-2018

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5 patents (USPTO):Explore Patents

Title: Innovations of Rajwant Sidhu

Introduction

Rajwant Sidhu is an accomplished inventor based in Brea, California. She has made significant contributions to the field of printed circuit board technology. With a total of 5 patents to her name, Sidhu has demonstrated her expertise and creativity in developing innovative solutions.

Latest Patents

One of her latest patents is titled "Method for anchoring a conductive cap on a filled via in a printed circuit board." This invention relates to forming an anchored cap in a filled via in a PCB. The cap is created by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion. This ensures that the anchored cap is securely attached to the filled via by the anchor portion. In another embodiment, both the anchor portion and cap portion may be deposited in a single step.

Another notable patent is "Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards." This invention describes methods for minimizing overhang on electroplated surfaces. One such method involves applying a first resist layer on a substrate with a first copper layer, followed by a series of steps including applying images, developing resist layers, and electroplating metallic layers. This innovative approach enhances the manufacturing process of printed circuit boards.

Career Highlights

Rajwant Sidhu has worked with several prominent companies, including DDI Global Corp and Viasystems Technologies Corporation. Her experience in these organizations has allowed her to refine her skills and contribute to various projects in the electronics industry.

Collaborations

Throughout her career, Sidhu has collaborated with talented individuals such as Ruben Zepeda and Carlos A Lopez. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Rajwant Sidhu's contributions to the field of printed circuit boards are noteworthy. Her innovative patents and collaborative efforts highlight her dedication to advancing technology. As an inventor, she continues to inspire others in the industry.

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