The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Apr. 23, 2015
Applicant:
Viasystems Technologies Corp., L.l.c., St. Louis, MO (US);
Inventors:
Rajwant Sidhu, Brea, CA (US);
Ruben Zepeda, Yorba Linda, CA (US);
Assignee:
VIASYSTEMS TECHNOLOGIES CORP. L.L.C., St. Louis, MO (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H05K 1/113 (2013.01); H05K 3/422 (2013.01); H05K 3/064 (2013.01); H05K 3/423 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/095 (2013.01);
Abstract
The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.