Chandler, AZ, United States of America

Rajeev Ranjan

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rajeev Ranjan. Retrieved from https://idiyas.com/inventor/rajeev-ranjan-76ot9nd1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Rajeev Ranjan: Innovator in Capacitor Technology

Introduction

Rajeev Ranjan is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of capacitor technology, particularly through his innovative patent. His work is recognized within the industry, and he is associated with a leading technology company.

Latest Patents

Rajeev holds a patent for "Capacitor pads and methods of manufacturing the same." This patent discloses an apparatus that includes a substrate to support a die, along with a die-side capacitor pad on the substrate. The die-side capacitor pad features a plurality of distinct pad portions that are spaced apart from one another. This innovation enhances the manufacturing process and functionality of capacitor pads.

Career Highlights

Rajeev Ranjan is currently employed at Intel Corporation, a global leader in technology and semiconductor manufacturing. His role at Intel allows him to work on cutting-edge projects that push the boundaries of electronic components. With a total of 1 patent, he has established himself as a valuable asset to the company.

Collaborations

Rajeev collaborates with talented coworkers, including Kristof Darmawikarta and Jung Kyu Han. Their combined expertise contributes to the advancement of technology within their projects.

Conclusion

Rajeev Ranjan's contributions to capacitor technology exemplify innovation in the field. His patent and work at Intel Corporation highlight his commitment to advancing electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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