This inventor holds 2 USPTO granted patents. Top assignees: Freescale Semiconductor,inc., Motorola Corporation. Active years: 2004-2007.
Company Filing History:
Years Active: 2004-2007
Title: Rajashi Runton: Innovator in Semiconductor Technology
Introduction
Rajashi Runton is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to device design.
Latest Patents
One of his latest patents is for a semiconductor device with a strain-relieving bump design. This device comprises a die with a contact pad, a redistribution conductor with a base portion in electrical communication with the contact pad, and a laterally extending portion. Additionally, it features a bumped contact that is also in electrical communication with the redistribution conductor, along with a passivation layer situated between the laterally extending portion of the redistribution conductor and the die. The design allows the redistribution conductor to peel or delaminate from the passivation layer under sufficient stress, enabling it to shift relative to the passivation layer and base portion. This innovative approach helps relieve mechanical stress between the substrate and the die, ensuring reliability without the need for underfill or additional assembly processes.
Career Highlights
Rajashi has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and Motorola Corporation. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor device design.
Collaborations
Throughout his career, Rajashi has collaborated with talented individuals such as James Jen-Ho Wang and Jin-Wook Jang, who have contributed to his projects and innovations.
Conclusion
Rajashi Runton's work in semiconductor technology exemplifies the spirit of innovation and problem-solving in the field. His patents reflect a commitment to advancing technology and improving device reliability.
