The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2004
Filed:
Jul. 31, 2003
James Jen-Ho Wang, Phoenix, AZ (US);
Jin-Wook Jang, Chandler, AZ (US);
Alfredo Mendoza, Mesa, AZ (US);
Rajashi Runton, Chandler, AZ (US);
Russell Shumway, Tempe, AZ (US);
Freescale Semiconductor, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device ( ) is provided. The device ( ) comprises a die ( ) having a contact pad ( ) thereon, a redistribution conductor ( ) having a base portion ( ) which is in electrical communication with the contact pad ( ) and a laterally extending portion ( ), a bumped contact ( ) which is in electrical communication with the redistribution conductor ( ), and a passivation layer ( ) disposed between the laterally extending portion ( ) of the redistribution conductor ( ) and the die ( ). Preferably, the redistribution conductor ( ) is convoluted and is adapted to peel or delaminate from the passivation layer ( ) under sufficient stress so that it can shift relative to the passivation layer ( ) and base portion ( ) to relieve mechanical stress between substrate ( ) and the die ( ). Bump and coiled redistribution conductor ( ) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.