This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: C.uyemura Co., Ltd.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Raihei Ikumoto: Innovator in Copper Electrolytic Plating Technology
Introduction
Raihei Ikumoto is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electroplating, particularly in the development of copper electrolytic plating technologies. His innovative work focuses on enhancing the physical properties of copper plating films.
Latest Patents
Raihei Ikumoto holds a patent for a copper electrolytic plating bath and copper electrolytic plating film. This invention provides a technology that allows for the co-deposition of sulfur to be significantly suppressed in copper electrolytic plating containing silver ions as an alloy component. The resulting copper electrolytic plating film exhibits excellent physical properties, such as strength and hardness, even after high-temperature heat treatment at approximately 200°C or higher. The copper electrolytic plating bath comprises copper ions, an acid, chloride ions, and a complexing agent, with silver ions included as an alloy component. Methionine or a derivative thereof is utilized as the complexing agent.
Career Highlights
Raihei Ikumoto has dedicated his career to advancing electroplating technologies. His work has been instrumental in improving the quality and durability of copper plating films, which are essential in various industrial applications. His innovative approach has garnered attention in the field and has led to advancements in manufacturing processes.
Collaborations
Raihei has collaborated with notable colleagues, including Yuki Itakura and Naoyuki Omura. Their combined expertise has contributed to the success of their projects and the development of new technologies in the electroplating industry.
Conclusion
Raihei Ikumoto is a distinguished inventor whose work in copper electrolytic plating technology has made a significant impact on the industry. His innovative patent demonstrates a commitment to enhancing the physical properties of electroplated materials. His contributions continue to influence advancements in manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile