Company Filing History:
1 out of 5,010 
1 out of 3 Years Active: 2008
Title: Innovations by Rahul Kapoor in Electronic Packaging
Introduction
Rahul Kapoor is a notable inventor based in Singapore, SG. He has made significant contributions to the field of electronic packaging, particularly with his innovative designs that enhance performance in high-density applications. His work is characterized by a focus on thermally efficient solutions that meet the demands of modern technology.
Latest Patents
One of Rahul Kapoor's key patents is titled "Molded high density electronic packaging structure for high performance applications." This patent describes a thermally enhanced ball grid array package that includes a base layer element and a flip chip die mounted on it. The design features a first surface that is electrically coupled to the base layer element, a second surface opposite to the first, and lateral sides. A molding compound encapsulates both the base layer element and the lateral sides of the die. The structure is designed to improve thermal management, making it suitable for high-performance applications.
Career Highlights
Throughout his career, Rahul Kapoor has worked with prominent companies in the technology sector. He has been associated with Xilinx, Inc., a leader in adaptive and intelligent computing, and Utac - United Test and Assembly Center Ltd., which specializes in semiconductor assembly and testing. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge projects.
Collaborations
Rahul has collaborated with talented professionals in his field, including Kim Yong Goh and Anthony Yi-Sheng Sun. These collaborations have fostered innovation and have been instrumental in the development of advanced electronic packaging solutions.
Conclusion
Rahul Kapoor's contributions to electronic packaging through his innovative patent and career experiences highlight his role as a significant inventor in the technology sector. His work continues to influence the design and functionality of high-performance electronic devices.