The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Feb. 03, 2004
Kim Yong Goh, Singapore, SG;
Rahul Kapoor, Singapore, SG;
Anthony Yi-sheng Sun, Singapore, SG;
Desmond Yok Rue Chong, Singapore, SG;
Lan H. Hoang, Fremont, CA (US);
Kim Yong Goh, Singapore, SG;
Rahul Kapoor, Singapore, SG;
Anthony Yi-Sheng Sun, Singapore, SG;
Desmond Yok Rue Chong, Singapore, SG;
Lan H. Hoang, Fremont, CA (US);
Xilinx, Inc., San Jose, CA (US);
UTAC - United Test and Assembly Test Center Ltd., Singapore, SG;
Abstract
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.