R Richard Steiner

Title: R Richard Steiner: Innovator in Circuit Board Technology

Introduction

R Richard Steiner is a notable inventor based in University Heights, OH (US), recognized for his contributions to the field of circuit board technology. With a total of four patents to his name, he has made significant advancements that enhance the functionality and durability of electronic components.

Latest Patents

Among his latest patents is the "Resin/Copper/Metal Laminate and Method of Producing Same." This innovative laminate is designed for use in the production of printed circuit boards and features a metal layer with a first and second side. The laminate includes a metallic substrate, with one side attached to the first side of the metal foil, and an adhesive substrate made of polymeric material. This substrate has a first surface attached to the second side of the copper foil, and it is at least partially uncured, complemented by a releasable protective film along its second surface. Another significant patent is for "Corrosion Prevention for CAC Component," which addresses the durability and longevity of electronic components.

Career Highlights

Throughout his career, R Richard Steiner has worked with prominent companies such as Nikko Materials USA, Inc. and Gould Electronics Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in the electronics industry.

Collaborations

R Richard Steiner has collaborated with esteemed colleagues, including Shiuh-Kao Chiang and Bernd Schneider. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

R Richard Steiner's work in circuit board technology exemplifies the spirit of innovation and dedication to improving electronic components. His patents reflect a commitment to enhancing the functionality and reliability of technology in our daily lives.