The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
May. 05, 2000
Bernd Schneider, March-Holzhausen, DE;
R. Richard Steiner, University Heights, OH (US);
GA-TEK Inc., Eastlake, OH (US);
Abstract
A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel substrate having a thickness from about 0.10 mm to about 0.20 mm. Applying a layer of copper having a thickness from about 2 &mgr;m to about 70 &mgr;m to each of the chromium layers. Positioning the steel substrate between two dielectric layers with adhesive disposed between the copper layers and the dielectric layers. Applying heat and pressure to the layers to bond the copper layers to the dielectric layers. Separating the steel substrate from the copper layers, and discarding the steel substrate.