Quoc Hung Luan

Title: Quoc Hung Luan: Innovator in Electrically Conductive Interconnection Technologies

Introduction

Quoc Hung Luan is a notable inventor based in Toulouse, France. He has made significant contributions to the field of electrical engineering, particularly in the development of methods for creating electrically conductive mechanical interconnection elements. His innovative approach has implications for the advancement of microelectronic devices.

Latest Patents

Luan holds a patent for a method of fabricating an electrically conductive mechanical interconnection element. This method involves two main stages: the electrochemical deposition of a structure comprising a plurality of metal wires of sub-micrometric diameter and a controlled partial dissolution of these wires to reduce their diameter. The process allows for the creation of mechanical and electrical interconnections by pressing two interconnection elements together, enabling the nanometric wires to interpenetrate and tangle. This technology is crucial for the development of three-dimensional electronic devices that consist of stacked microelectronic chips.

Career Highlights

Throughout his career, Quoc Hung Luan has worked with prestigious institutions such as the Centre National de la Recherche Scientifique and Université Paul Sabatier. His work has been instrumental in advancing research in the field of microelectronics and conductive materials.

Collaborations

Luan has collaborated with notable colleagues, including Patrice Simon and Pierre-Louis Taberna. Their joint efforts have contributed to the success of various research projects and innovations in the field.

Conclusion

Quoc Hung Luan's contributions to the field of electrically conductive interconnection technologies highlight his role as an influential inventor. His innovative methods and collaborations continue to shape advancements in microelectronics.