Beijing, China

Quan Cheng

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Beijing University of Technology. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Quan Cheng. Retrieved from https://idiyas.com/inventor/quan-cheng-di3x4h99

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Quan Cheng in Non-Destructive Detection

Introduction

Quan Cheng is a notable inventor based in Beijing, China. He has made significant contributions to the field of non-destructive detection, particularly in measuring stress distribution in thin metal plates. His innovative approach utilizes advanced wave mixing techniques to enhance the accuracy and efficiency of stress detection.

Latest Patents

Quan Cheng holds a patent for a non-linear Lamb wave mixing method for measuring stress distribution in thin metal plates. This invention discloses a method that is suitable for detecting stress distribution and positioning stress concentration areas in plate structures. The method involves determining excitation frequencies of two fundamental waves based on the measured object and resonance conditions. By exciting A0 mode waves at both ends of the test piece, the invention allows for the detection of non-linear mixing stress within the plate structure. The process includes changing the excitation time delay to perform mixing scans at different positions, ultimately enabling the detection of stress distribution and the identification of stress concentration areas.

Career Highlights

Quan Cheng is affiliated with the Beijing University of Technology, where he continues to advance research in non-destructive testing methods. His work has garnered attention for its practical applications in various engineering fields, particularly in ensuring the integrity of metal structures.

Collaborations

Quan Cheng has collaborated with colleagues such as Jingpin Jiao and Li Li, contributing to the development of innovative solutions in the realm of stress detection and material analysis.

Conclusion

Quan Cheng's contributions to the field of non-destructive detection through his innovative patent demonstrate his commitment to advancing technology in stress measurement. His work not only enhances the understanding of material integrity but also paves the way for future innovations in engineering applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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