Company Filing History:
Years Active: 2017
Title: Qinglong Zhang: Innovator in Semiconductor Technology
Introduction: Qinglong Zhang is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, particularly in the area of underfill materials used in electronic devices. His innovative approach has led to the development of a unique method that enhances the efficiency of underfill provision.
Latest Patents: Qinglong Zhang holds 1 patent for his invention titled "Thermally-enhanced provision of underfill to electronic devices using a stencil." This patent describes a method of feeding underfill material to fill the space between a semiconductor die and a substrate. The process involves positioning a stencil over the semiconductor die, which has an elongated slot adjacent to its edge. Underfill material is printed through this slot, allowing it to fall onto the substrate. The material is then heated, enabling it to flow across the space through capillary action.
Career Highlights: Qinglong Zhang is currently employed at Asm Technology Singapore Pte Ltd, where he continues to work on advancing semiconductor technologies. His expertise in the field has made him a valuable asset to his company and the industry as a whole.
Collaborations: Qinglong has collaborated with notable colleagues, including John Hon Shing Lau and Ming Li. Their combined efforts contribute to the innovative projects at Asm Technology Singapore Pte Ltd.
Conclusion: Qinglong Zhang's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work not only enhances the efficiency of electronic devices but also showcases the importance of collaboration in driving technological progress.