Qinglin Zeng

Title: The Innovations of Qinglin Zeng

Introduction

Qinglin Zeng is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor technology. His work focuses on developing advanced semiconductor devices that enhance performance and efficiency.

Latest Patents

Qinglin Zeng holds 1 patent for his invention titled "Semiconductor devices and semiconductor dice including electrically conductive interconnects between die rings." This patent describes a semiconductor device that includes a semiconductor die with integrated circuitry over a substrate of semiconductor material. The design features a first die ring that comprises electrically conductive materials surrounding the integrated circuitry, creating a conductive path from the substrate surface to the semiconductor die's exposed surface. Additionally, a second die ring is disposed around the first, with an electrically conductive interconnect linking the two die rings. This innovation has implications for related semiconductor devices and dice.

Career Highlights

Qinglin Zeng is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His role involves research and development, where he applies his expertise to create cutting-edge technologies. His contributions have been instrumental in advancing the company's product offerings.

Collaborations

Qinglin has collaborated with talented coworkers, including Hongbin Zhu and Daniel Osterberg. Their combined efforts in research and development have led to innovative solutions in semiconductor technology.

Conclusion

Qinglin Zeng's work exemplifies the spirit of innovation in the semiconductor field. His patent and contributions at Micron Technology Incorporated highlight his commitment to advancing technology. His achievements continue to influence the industry and pave the way for future advancements.