Qing Ran

Title: Qing Ran - Innovator in Laser Technology

Introduction

Qing Ran is a notable inventor based in Sichuan, China. She has made significant contributions to the field of laser technology, particularly in the area of wafer singulation. Her innovative approach has led to the development of a unique method that enhances the efficiency and precision of wafer dicing.

Latest Patents

Qing Ran holds a patent for a method titled "Splash resistant laser wafer singulation by crack length control." This patent describes a process where a wafer is positioned with its top side on a tape material. The wafer consists of multiple die separated by scribe streets. The method involves directing a first infrared (IR) laser beam at the bottom side of the wafer, creating an embedded crack line that does not reach the top side surface. A second IR laser beam is then used to extend this crack line to the top side surface, ensuring precise dicing without compromising the integrity of the wafer.

Career Highlights

Qing Ran is currently employed at Texas Instruments Corporation, where she continues to innovate and develop advanced technologies. Her work has been instrumental in improving manufacturing processes within the semiconductor industry.

Collaborations

She collaborates with talented colleagues, including Yang Liu and Hao Zhang, who contribute to her projects and enhance the overall research environment.

Conclusion

Qing Ran's contributions to laser technology and wafer singulation exemplify her dedication to innovation in the semiconductor field. Her patent reflects a significant advancement that could influence future manufacturing techniques.