The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2025
Filed:
Nov. 30, 2021
Texas Instruments Incorporated, Dallas, TX (US);
Yang Liu, Sichuan, CN;
Hao Zhang, Sichuan, CN;
Venkataramanan Kalyanaraman, Allen, TX (US);
Joseph O Liu, Plano, TX (US);
Qing Ran, Sichuan, CN;
Yuan Zhang, Sichuan, CN;
Gelline Joyce Untalan Vargas, Marikina, PH;
Jeniffer Otero Aspuria, Baguio, PH;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A method of dicing a wafer includes positioning the wafer with its top side on a tape material. The wafer includes a plurality of die separated by scribe streets. A first pass being a first infrared (IR) laser beam is directed at the bottom side with a point of entry within the scribe streets. The first IR laser beam is focused with a focus point embedded within a thickness of the wafer, and has parameters selected to form an embedded crack line within the wafer. The embedded crack line does not reach the top side surface. A second pass being a second IR laser beam is directed at the bottom side having parameters selected to form a second crack line that that has a spacing relative to the embedded crack line, and the second IR laser beam causes the embedded crack line to be extended to the top side surface.