This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2014.
Company Filing History:
1 out of 1,231 
1 out of 778 Years Active: 2014
Title: Qing-Ping Yan: Innovator in Electronic Device Technology
Introduction
Qing-Ping Yan is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of electronic devices, particularly in heat dissipation technologies. His innovative approach has led to the development of a unique electronic device that enhances performance and efficiency.
Latest Patents
Qing-Ping Yan holds a patent for an "Electronic device with heat pipe chamber cover for dissipating heat." This exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium, and at least one electronic element. The cover and the base cooperatively define a cavity, while the side plates extend from the cover and are received in the cavity. The heat conduct plate, side plates, and cover together form a sealed chamber. The wick structure is attached to the inner surface of this sealed chamber, and the working medium is contained within the wick structure. The electronic element is thermally connected to the heat conduct plate, ensuring efficient heat dissipation.
Career Highlights
Throughout his career, Qing-Ping Yan has worked with prominent companies in the technology sector. He has been associated with Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has contributed to his expertise in electronic device innovation.
Collaborations
Qing-Ping Yan has collaborated with several talented individuals in his field, including De-Yu Wang and Jiang-Jun Hu. These collaborations have fostered a creative environment that has led to advancements in electronic device technology.
Conclusion
Qing-Ping Yan is a distinguished inventor whose work in electronic devices has made a significant impact on the industry. His innovative patent for heat dissipation technology exemplifies his commitment to enhancing electronic device performance. His contributions continue to influence the field and inspire future innovations.