This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Hon Hai Precision Industry Co., Ltd., Hongfujin Precision Electronics (Zhengzhou) Co., Ltd.. Active years: 2019.
Company Filing History:
1 out of 19,792 
1 out of 80 Years Active: 2019
Title: Qing-Lei Pan: Innovator in Soldering Technology
Introduction
Qing-Lei Pan is a notable inventor based in Zhengzhou, China. He has made significant contributions to the field of soldering technology, particularly with his innovative clamping device designed for soldering operations. His work has garnered attention for its practical applications in electronics manufacturing.
Latest Patents
Qing-Lei Pan holds a patent for a clamping device for soldering operations. This device utilizes its own weight to apply pressure to solderable parts or components during the soldering process. The clamping device features a base plate and at least one press block that can move up or down by gravity. When positioned correctly, the press block exerts downward pressure on the solderable part, ensuring effective soldering.
Career Highlights
Throughout his career, Qing-Lei Pan has worked with prominent companies in the electronics industry. Notably, he has been associated with Hon Hai Precision Industry Co., Ltd. and Hongfujin Precision Electronics (Zhengzhou) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in soldering technology.
Collaborations
Qing-Lei Pan has collaborated with talented individuals in his field, including coworkers Bing Liu and Shi-Li Zhang. Their collective expertise has likely influenced his innovative approaches and solutions in soldering operations.
Conclusion
Qing-Lei Pan's contributions to soldering technology through his patented clamping device demonstrate his commitment to innovation in the electronics industry. His work continues to impact the efficiency and effectiveness of soldering processes.