The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Oct. 28, 2016
Hongfujin Precision Electronics (Zhengzhou) Co., Ltd., Zhengzhou, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Xi-Hang Li, Zhengzhou, CN;
Bing Liu, Zhengzhou, CN;
Wei Wu, Zhengzhou, CN;
Qing-Lei Pan, Zhengzhou, CN;
Shi-Li Zhang, Zhengzhou, CN;
Yuan Gao, Zhengzhou, CN;
HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., Zhengzhou, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.