Shenzhen, China

Qifeng Yu

This inventor holds 1 USPTO granted patent. Top assignees: Shenzhen University, Shenzhen Wivision Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qifeng Yu. Retrieved from https://idiyas.com/inventor/qifeng-yu-d40clep7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Qifeng Yu: Innovator in Deformation Measurement Technology

Introduction

Qifeng Yu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of deformation measurement technology. His innovative approach has led to the development of a unique method and apparatus that enhances measurement accuracy.

Latest Patents

Qifeng Yu holds a patent for a "Method and apparatus for deformation measurement, electronic device, and storage medium." This invention provides a method for deformation measurement by utilizing a mobile platform that captures images of monitoring points in designated areas. The process involves obtaining images at different monitoring positions to determine horizontal displacement and vertical subsidence amounts of the monitoring points.

Career Highlights

Throughout his career, Qifeng Yu has worked with prominent institutions such as Shenzhen University and Shenzhen Wivision Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Qifeng Yu has collaborated with talented individuals in his field, including Yihe Yin and Xiaolin Liu. These partnerships have fostered innovation and have been instrumental in the development of his patented technology.

Conclusion

Qifeng Yu's work in deformation measurement technology exemplifies the impact of innovative thinking in engineering. His contributions continue to influence the field and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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