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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12591995 B1

PDFFull Text
Date of Patent:
Mar. 31, 2026

Filed:

Sep. 20, 2024

Method and apparatus for deformation measurement, electronic device, and storage medium

Applicants:

Shenzhen University, Shenzhen Guangdong, CN;

Shenzhen Wivision Technology Co., Ltd., Shenzhen Guangdong, CN;

Inventors:

Yihe Yin, Shenzhen Guangdong, CN;

Qifeng Yu, Shenzhen Guangdong, CN;

Xiaolin Liu, Shenzhen Guangdong, CN;

Yueqiang Zhang, Shenzhen Guangdong, CN;

Biao Hu, Shenzhen Guangdong, CN;

Assignees:

SHENZHEN UNIVERSITY, Shenzhen, CN;

SHENZHEN WIVISION TECHNOLOGY CO., LTD., Shenzhen, CN;

Attorney:

Scully, Scott, Murphy & Presser, P.C.

Primary Examiner:

Trang U Tran

Int. Cl.
CPC ...
H04N 7/18 (2006.01); G01M 5/00 (2006.01); G06T 7/00 (2017.01); G06T 7/73 (2017.01);
U.S. Cl.
CPC ...
G06T 7/73 (2017.01); G01M 5/005 (2013.01); G01M 5/0091 (2013.01); G06T 7/0002 (2013.01);
Abstract

A method for deformation measurement is provided. When the mobile platform moves to a first monitoring position in an area to-be-measured, a first image is obtained by photographing Jmonitoring points in a first area to-be-measured in the area to-be-measured, and a second image is obtained by Jmonitoring points in a second area to-be-measured in the area to-be-measured. When the mobile platform moves to a second monitoring position, a third image is obtained by photographing the Jmonitoring points, and a fourth image is obtained by photographing the Jmonitoring points. Jfirst monitoring points are determined according to the first image and the third image, and Jsecond monitoring points are determined according to the second image and the fourth image. A horizontal displacement amount and a vertical subsidence amount of each of the Jfirst monitoring points and the Jsecond monitoring points are obtained.

Find Patent Forward Citations

Yin, Yihe. (2026). Method and apparatus for deformation measurement, electronic device, and storage medium (U.S. Patent No. 12591995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12591995

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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