Primitivo A Palasi

Title: Primitivo A Palasi: Innovator in Lead Frame Technology

Introduction

Primitivo A Palasi is a notable inventor based in Baguio, Philippines. He has made significant contributions to the field of lead frame technology, holding a total of four patents. His innovative designs have advanced the manufacturing processes of integrated circuit chip packages.

Latest Patents

One of his latest patents is titled "Lead frame with plated end leads." This invention comprises a lead frame that defines a central opening, within which a die pad is connected to the frame. A plurality of leads extends within the opening toward the die pad, with each lead featuring opposed top and bottom surfaces, an inner end, an outer end, and a pair of side surfaces. The design includes a corner region that accommodates the flow of reflow solder.

Another significant patent is "Reduced copper lead frame for saw-singulated chip package." This lead frame strip is designed for the manufacture of integrated circuit chip packages. It includes an array defining multiple lead frames, each with an outer frame and a central opening containing a die pad. The leads extend toward the die pad in a spaced relation, and the design allows for efficient separation of the lead frames during manufacturing.

Career Highlights

Primitivo A Palasi has worked with Amkor Technology, Inc., where he applied his expertise in lead frame technology. His work has contributed to advancements in the production of integrated circuits, enhancing the efficiency and effectiveness of chip packaging.

Collaborations

Throughout his career, Primitivo has collaborated with notable professionals such as Harry J Fogelson and Ahmer Raza Syed. These collaborations have fostered innovation and development in the field of semiconductor technology.

Conclusion

Primitivo A Palasi's contributions to lead frame technology have made a significant impact on the semiconductor industry. His patents reflect his innovative spirit and dedication to advancing manufacturing processes. His work continues to influence the development of integrated circuit packaging solutions.