The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2007

Filed:

Jun. 11, 2003
Applicants:

Harry J. Fogelson, Tempe, AZ (US);

Ludcvico Estrada Bancod, Chandler, AZ (US);

Ahmer Syed, Chandler, AZ (US);

Terry Davis, Gilbert, AZ (US);

Primitivo A. Palasi, Baguio, PH;

William M. Anderson, Gilbert, AZ (US);

Inventors:

Harry J. Fogelson, Tempe, AZ (US);

Ludcvico Estrada Bancod, Chandler, AZ (US);

Ahmer Syed, Chandler, AZ (US);

Terry Davis, Gilbert, AZ (US);

Primitivo A. Palasi, Baguio, PH;

William M. Anderson, Gilbert, AZ (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.


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