Harry J Fogelson

Title: The Innovative Contributions of Harry J. Fogelson

Introduction

Harry J. Fogelson is a notable inventor based in Tempe, AZ (US), recognized for his contributions to the field of integrated circuit packaging. With a total of 3 patents to his name, Fogelson has made significant advancements in lead frame technology.

Latest Patents

Fogelson's latest patents include innovative designs that enhance the functionality and efficiency of lead frames. One of his patents, titled "Lead frame with plated end leads," describes a lead frame that comprises a frame defining a central opening. Within this opening is a die pad connected to the frame, along with a plurality of leads extending toward the die pad. Each lead features opposed top and bottom surfaces, an inner end, an outer end, and a pair of side surfaces. A recess is formed within the corner region of the lead, accommodating the flow of reflow solder. Another significant patent is "Reduced copper lead frame for saw-singulated chip package," which details a lead frame strip designed for manufacturing integrated circuit chip packages. This strip includes an array of lead frames, each with an outer frame and a central opening containing a die pad. The design allows for efficient separation of lead frames through saw streets.

Career Highlights

Throughout his career, Fogelson has worked with prominent companies, including Amkor Technology, Inc. His experience in the industry has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Fogelson has collaborated with talented individuals such as Ahmer Raza Syed and Primitivo A. Palasi, further enhancing his work and expanding his impact in the field.

Conclusion

Harry J. Fogelson's innovative patents and career achievements highlight his significant contributions to the field of integrated circuit packaging. His work continues to influence the industry and inspire future innovations.