Company Filing History:
Years Active: 2021-2022
Title: An Insight into the Innovations of Prashant Pathak
Introduction
Prashant Pathak is an accomplished inventor based in Santa Clara, California. He has made significant contributions to the field of integrated circuits, specifically in the realm of package design. With a total of two patents to his name, his innovations reflect the advancements in technology that are essential for modern electronics.
Latest Patents
Prashant's latest patents focus on "IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures." This innovation includes an integrated circuit die that features a major surface with one or more solder bumps strategically located in the corner regions. The design involves a substrate surface equipped with bump pads, to which the solder bumps are bonded, forming a secure bond joint. The major surface of the integrated circuit die has a footprint area of at least about 400 mm, with a crucial consideration being the ratio of the coefficient of thermal expansion (CTE) of the substrate to that of the die, which stands at least about 3:1. Prashant has also disclosed a method of manufacturing an IC package within these patents, which optimally addresses thermal mismatch challenges.
Career Highlights
Currently, Prashant Pathak is associated with Nvidia Corporation, where he utilizes his expertise to push the boundaries of IC packaging technology. His career has been marked by a commitment to innovation and quality, contributing significantly to the advancement of the company's product offerings.
Collaborations
Throughout his career, Prashant has collaborated with notable coworkers, including Jayprakash Chipalkatti and Zuhair Bokharey. These partnerships reflect a collaborative spirit that is critical in the fast-evolving field of technology and innovation, allowing for the exchange of ideas and fostering breakthroughs in integrated circuit design.
Conclusion
In conclusion, Prashant Pathak stands out as a visionary inventor within the semiconductor industry. His work on IC package design not only showcases his ingenuity but also highlights the importance of addressing thermal expansion challenges in modern electronics. With a keen eye towards the future, his contributions continue to aid in the development of cutting-edge technologies.