This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2012-2013.
Company Filing History:
Years Active: 2012-2013
Title: Prasanna Karpur: Innovator in Integrated Circuit Packaging
Introduction
Prasanna Karpur is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents to his name, Karpur's work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
Karpur's latest patents include innovative methods and apparatuses designed to stiffen integrated circuit packages. One of his inventions features a dam stiffener for a package substrate, which comprises a thermally curable polymer. This dam stiffener is cured simultaneously with the underfill material, providing additional support to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer that acts as an additional stiffener for the package substrate.
Career Highlights
Prasanna Karpur is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in semiconductor technology. His work has been instrumental in developing solutions that improve the structural integrity of integrated circuits.
Collaborations
Karpur collaborates with Sriram Muthukumar, leveraging their combined expertise to drive advancements in their field.
Conclusion
Prasanna Karpur's contributions to integrated circuit packaging exemplify the importance of innovation in technology. His patents reflect a commitment to enhancing the performance and reliability of electronic devices.