This inventor holds 1 USPTO granted patent. Top assignee: Lsi Logic Corporation. Active years: 2004.
Company Filing History:
Years Active: 2004
Title: Pradip D Patei: Innovator in Integrated Circuit Packaging
Introduction
Pradip D Patei is a notable inventor based in Redwood City, CA (US). He has made significant contributions to the field of integrated circuit packaging, particularly with his innovative patent that enhances the functionality of circuit substrates.
Latest Patents
One of Pradip's key patents is titled "Solder mask on bonding ring." This invention represents an improvement to an integrated circuit package substrate that features a bonding ring with an exposed upper surface. The design includes a first portion of the exposed upper surface intended for receiving a molding compound, while a second portion is designated for electrical connections. A solder mask is strategically formed on the first portion of the exposed upper surface of the bonding ring, optimizing the overall performance of the integrated circuit package.
Career Highlights
Pradip D Patei is currently employed at LSI Logic Corporation, where he continues to innovate and contribute to advancements in technology. His work has been instrumental in developing solutions that enhance the reliability and efficiency of electronic devices.
Collaborations
Throughout his career, Pradip has collaborated with talented professionals, including Severino A Legaspi, Jr. and Manickam Thavarajah. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Pradip D Patei's contributions to integrated circuit packaging through his innovative patent demonstrate his commitment to advancing technology. His work at LSI Logic Corporation and collaborations with esteemed colleagues highlight his role as a significant figure in the field of electronics.