The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2004
Filed:
Aug. 28, 2002
Applicant:
Inventors:
Maurice Othieno, Union City, CA (US);
Aritharan Thurairajaratnam, San Jose, CA (US);
Manickam Thavarajah, San Jose, CA (US);
Pradip D. Patei, Redwood City, CA (US);
Severino A. Legaspi, Jr., Santa Clara, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/352 ;
Abstract
An improvement to an integrated circuit package substrate of the type that has a bonding ring with an exposed upper surface, where a first portion of the exposed upper surface is for receiving a molding compound and a second portion of the exposed upper surface is for receiving an electrical connection. A solder mask is formed on the first portion of the exposed upper surface of the bonding ring.