Lehi, UT, United States of America

Pradeep Ramachandran


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2020-2025

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3 patents (USPTO):

Title: Pradeep Ramachandran: Innovator in Predictive Technologies

Introduction

Pradeep Ramachandran is a notable inventor based in Lehi, UT (US). He has made significant contributions to the field of predictive technologies, particularly in the area of virtual metrology for semiconductor manufacturing. With a total of 3 patents, his work has advanced the capabilities of imaging systems and predictive modeling.

Latest Patents

Pradeep's latest patents include a system for predicting properties of structures and an imager system. One of his key inventions is a method of predicting virtual metrology data for a wafer lot. This method involves receiving first image data from an imager system, which relates to at least one first wafer lot. It also includes receiving measured metrology data from metrology equipment for the same wafer lot. By applying machine learning techniques to both the first image data and the measured metrology data, Pradeep generates predictive models. These models are utilized to produce virtual metrology data or virtual cell metrics data for the wafer lots.

Career Highlights

Pradeep Ramachandran is currently employed at Micron Technology Incorporated, where he continues to innovate and develop new technologies. His work at Micron has positioned him as a key player in the semiconductor industry, contributing to advancements that enhance manufacturing processes.

Collaborations

Throughout his career, Pradeep has collaborated with talented individuals such as Amitava Majumdar and Qianlan Liu. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the field.

Conclusion

Pradeep Ramachandran's contributions to predictive technologies and his innovative patents highlight his role as a significant inventor in the semiconductor industry. His work continues to influence advancements in virtual metrology and imaging systems.

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