This inventor holds 2 USPTO granted patents. Top assignee: Chipmos Technologies Inc.. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Po-Kai Hou: Innovator in Chip Packaging Technology
Introduction
Po-Kai Hou is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 2 patents. His innovative approaches have advanced the methods used in the fabrication of electronic components.
Latest Patents
One of his latest patents is titled "Method of fabricating quad flat non-leaded package." This method involves forming a patterned conductive layer on a sacrificial layer, attaching chips to the sacrificial layer, and ensuring each chip is electrically connected to lead sets. The process includes covering the patterned conductive layer and chips with a molding compound, which is then cut and singulated after the sacrificial layer is pre-cut. The sacrificial layer is ultimately removed, revealing the finished product.
Another significant patent is for a "Chip package with a dam structure on a die pad." This invention features a die pad with a blocking portion on its top surface, surrounded by leads. The chip is placed on the die pad and is electrically connected to the leads, with an adhesive layer in between. The molding compound encapsulates the chip, a portion of the leads, and the die pad, enhancing the overall structure and functionality of the package.
Career Highlights
Po-Kai Hou is currently employed at Chipmos Technologies Inc., a company known for its expertise in semiconductor packaging and testing services. His work at Chipmos has allowed him to focus on innovative solutions that improve chip packaging processes.
Collaborations
Throughout his career, Po-Kai has collaborated with talented individuals such as Chun-Ying Lin and Geng-Shin Shen. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Po-Kai Hou's contributions to chip packaging technology through his patents and work at Chipmos Technologies Inc. highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of electronic component manufacturing.