This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2022-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2025
Title: Po-Hsien Chiu: Innovator in Box Erecting Technology
Introduction
Po-Hsien Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of packaging technology, particularly in the development of box erecting apparatuses. With a total of three patents to his name, Chiu continues to push the boundaries of innovation in his industry.
Latest Patents
Chiu's latest patent is a box erecting apparatus and method. This invention involves an apparatus designed to expand a box blank into a fully formed box. The apparatus comprises an arm assembly, a controller, a camera, and a box blank conveyor. The arm assembly features a folding arm that can adjust its position and rotational angle based on the controller's commands. These commands are informed by the position of a feature of the box blank, which is captured by the camera. The camera plays a crucial role in positioning the arm assembly and determining whether a box blank should be rejected.
Career Highlights
Chiu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise in engineering and innovation. His work has been instrumental in enhancing the efficiency and effectiveness of packaging processes.
Collaborations
Chiu collaborates with talented coworkers, including Szu-Chen Huang and Fu-Hsien Li. Their combined efforts contribute to the advancement of technology in their field.
Conclusion
Po-Hsien Chiu is a prominent figure in the realm of packaging technology, with a focus on box erecting innovations. His patents reflect his commitment to improving manufacturing processes, and his collaborations further enhance his contributions to the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile