Po-Chen Lin

Title: Po-Chen Lin: Innovator in Substrate Structures and Embedded Chip Packages

Introduction

Po-Chen Lin is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronics through his innovative patents. With a total of 3 patents, Lin has focused on developing advanced substrate structures and embedded chip packages.

Latest Patents

One of Lin's latest patents is for a substrate structure and manufacturing method. This invention includes a glass substrate, a first circuit layer, a second circuit layer, and at least one conductive region. The glass substrate features a first surface and a second surface opposing the first surface. The first circuit layer is positioned on the first surface, while the second circuit layer is located on the second surface. The conductive region consists of multiple conductive micro vias that penetrate through the glass substrate. These micro vias are electrically connected to both the first and second circuit layers, with a via size ranging from 2 µm to 10 µm.

Another significant patent by Lin is for an embedded chip package, which includes a circuit board, a chip, a dielectric material layer, and a build-up circuit structure. The circuit board is made of a glass substrate and contains at least one conductive via. The glass substrate has a first surface, a second surface opposite the first surface, and a through-hole that penetrates the substrate. The chip is placed inside this through-hole, and the dielectric material layer fills the hole, covering the chip. The build-up circuit structure is then positioned on the circuit board and is electrically connected to the conductive via, with the lower surface of the chip exposed outside the dielectric material layer.

Career Highlights

Throughout his career, Po-Chen Lin has worked with prominent companies such as Unimicron Technology Corporation and the Industrial Technology Research Institute. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the field of electronics.

Collaborations

Lin has collaborated with talented individuals in his field, including Chun-Hsien Chien and Chien-Chou Chen. These partnerships have fostered a creative environment that has led to the development of innovative technologies.

Conclusion

Po-Chen Lin's contributions to substrate structures and embedded chip packages highlight his role as a leading inventor in the electronics industry. His innovative patents and collaborations with esteemed colleagues demonstrate his commitment