Ping Miao

Title: Innovations of Ping Miao in Semiconductor Packaging

Introduction

Ping Miao is a notable inventor based in Singapore, recognized for his contributions to semiconductor packaging technology. He has developed innovative methods that enhance the efficiency and reliability of flip chip packages. His work is particularly significant in the context of modern electronics, where miniaturization and performance are critical.

Latest Patents

Ping Miao holds a patent for a method of fabricating a flip chip package with pillar bump and no flow underfill. This invention details a technique for joining a semiconductor integrated circuit (IC) chip in a flip chip configuration using pillar bumps. The method allows for the attachment of the semiconductor device to a substrate via no flow underfill under thermal compression bonding. This innovation addresses the challenges of incorporating low coefficient of thermal expansion (CTE) materials and achieving high assembly yields, especially for lead-free bumps. The invention is particularly beneficial for flip chip packages that require fine pitch and high pin counts.

Career Highlights

Ping Miao is currently employed at Advanpack Solutions Pte Ltd., where he continues to advance his research and development efforts in semiconductor packaging. His expertise in this field has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Throughout his career, Ping Miao has collaborated with talented professionals, including Tie Wang and Chun Sing Colin Lum. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ping Miao's contributions to semiconductor packaging through his patented methods exemplify the importance of innovation in technology. His work not only enhances product performance but also addresses the evolving demands of the electronics industry.