Ping-Liang Liu

Title: Innovations of Ping-Liang Liu

Introduction

Ping-Liang Liu is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on improving interconnect structures, which are crucial for the performance of electronic devices.

Latest Patents

Ping-Liang Liu holds a patent for an "Interconnect structure and method of fabricating same." This invention presents an improved interconnect that electrically connects two otherwise separate areas on a semiconductor wafer. The interconnect utilizes a copper conductor disposed within a trench and via structure formed in a low-k hybrid dielectric layer using a dual damascene process. Each contact region is served by a plurality of vias, each in communication with the trench conductor portion. The entry from the trench to the via is rounded for at least one and preferably all of the via structures. He has 1 patent to his name.

Career Highlights

Ping-Liang Liu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing advanced technologies that enhance the efficiency and performance of semiconductor devices.

Collaborations

He has collaborated with notable colleagues such as Hsueh-Chung Chen and Chine-Gie Lou, contributing to various projects within the semiconductor field.

Conclusion

Ping-Liang Liu's innovative work in semiconductor technology, particularly in interconnect structures, showcases his expertise and commitment to advancing the industry. His contributions are vital for the ongoing development of electronic devices.