Ping-Ching Jiang

Title: Innovations of Ping-Ching Jiang in Electroplating Technology

Introduction: Ping-Ching Jiang, an esteemed inventor located in Tainan, Taiwan, has made significant contributions to the field of electroplating. With two patents to his name, Jiang's work focuses on developing advanced plating apparatuses and methodologies essential for the semiconductor industry.

Latest Patents: Jiang's most notable patents include a pioneering plating apparatus and method for electroplating wafers. This innovative apparatus features a housing that defines a plating chamber, which houses a specialized plating solution. A unique aspect of this technology is the voltage source comprising a first terminal with a specific polarity, while the second terminal possesses a different polarity. The first terminal connects directly to the wafer, while the anode is positioned within the plating chamber, connected to the second terminal. Additionally, the apparatus contains a membrane support situated above the anode, characterized by defined apertures. These apertures exhibit varying area ratios across the membrane, optimizing the plating process and enhancing performance.

Career Highlights: Currently, Jiang is associated with Taiwan Semiconductor Manufacturing Company Ltd., where he actively participates in advancing semiconductor fabrication technologies. His continuous research and innovative designs play a pivotal role in enhancing the efficiency and capability of electroplating techniques utilized in the production of microelectronic devices.

Collaborations: Throughout his career, Jiang has collaborated with talented professionals, including notable coworkers Hung-San Lu and Chao-Lung Chen. Together, they have contributed to various projects aimed at improving the functionality and reliability of plating procedures in semiconductor manufacturing.

Conclusion: Ping-Ching Jiang stands out as a prominent inventor in the realm of electroplating, demonstrating a commitment to innovation within the semiconductor industry. Through his patents and collaborative efforts, Jiang's work continues to shape the landscape of wafer electroplating technology, benefiting advancements in electronic manufacturing.