Houston, TX, United States of America

Pinche Tsai


 

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 31(Granted Patents)


Location History:

  • Richardson, TX (US) (2018 - 2022)
  • Houston, TX (US) (2019 - 2023)

Company Filing History:


Years Active: 2018-2023

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11 patents (USPTO):

Title: Innovator Spotlight: Pinche Tsai from Houston, TX

Introduction: Pinche Tsai is a distinguished inventor based in Houston, Texas, known for his significant contributions in the field of thermal interface technology and connector design. With a remarkable portfolio of 11 patents, Tsai showcases his dedication to innovation and technical excellence.

Latest Patents: Among his latest inventions, Tsai has developed a thermal interface apparatus for PCI express M.2 printed circuit assemblies. This innovative apparatus incorporates two layers of thermal interface material, with a printed circuit assembly positioned between them. This design effectively enhances thermal coupling between integrated circuits and the thermal interface materials for improved performance. Another notable patent addresses blind mate connections with distinct sets of datums, which enhance stacking tolerance and insertion ease for printed circuit boards. These inventions reflect Tsai's commitment to advancing technology in effective ways.

Career Highlights: Tsai's career is marked by his role at Hewlett Packard Enterprise Development LP, where he has played a pivotal part in designing solutions that meet the evolving needs of technology users. His extensive patent portfolio stands testament to his innovative approach and problem-solving abilities in engineering.

Collaborations: Throughout his career, Tsai has worked alongside talented engineers such as Minh H Nguyen and David A Selvidge. Their collaborative efforts have contributed to the development of cutting-edge technologies that not only address current challenges but also anticipate future demands in the industry.

Conclusion: Pinche Tsai exemplifies the spirit of innovation that drives change in the technology landscape. His contributions, highlighted by his numerous patents and collaborative endeavors at Hewlett Packard Enterprise Development LP, ensure that he remains a significant figure in the field of inventions that enhance electronic connectivity and thermal management solutions.

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