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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10499488 B1

PDFFull Text
Date of Patent:
Dec. 03, 2019

Filed:

Oct. 19, 2018

Liquid-cooled integrated circuit system

Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Pinche Tsai, Houston, TX (US);

Minh H. Nguyen, Houston, TX (US);

Assignee:

Hewlett Packard Enterprise Development LP, Houston, TX (US);

Attorney:

Sheppard Mullin Richter & Hampton

Primary Examiner:

Mandeep S Buttar

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/42 (2006.01); H01L 23/367 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/30 (2006.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/367 (2013.01); H01L 23/42 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H01R 12/737 (2013.01); H05K 2201/042 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10325 (2013.01);
Abstract

A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.

Find Patent Forward Citations

Tsai, Pinche. (2019). Liquid-cooled integrated circuit system (U.S. Patent No. 10499488). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10499488

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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