Hewlett Packard Enterprise Development LP

Pinche Tsai

Minh H Nguyen

Kevin D Conn

David A Selvidge

James Jeffery Schulze

Keith A Sauer

Chanh V Hua

Stephen Spencer

Daniel W Tower

David Scott Chialastri

Kevin F Labbe

Kapil Rao Ganta Papa Rao Bala

Michael Sterns

In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.

Thermal interface apparatus for PCI express M.2 printed circuit assemblies

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards ('PCBs') prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a 'float' for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

Blind mate connections with different sets of datums

Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.

Vertical lift heat transfer device for pluggable modules

A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

Hinged dimm cooling device

Examples described herein include air impeding structures with snap-in tabs. In some examples, an air impeding structure for a processing unit socket cover includes a main body encloses an interior space, a first snap-in tab, and a second snap-in tab. The main body may include a first curved wall at a first end of the main body connected to a second curved wall at a second end of the main body. The first snap-in tab extends below the first end of the main body and is recessed in relation to the first curved wall. The second snap-in tab extends below the second end of the main body and is recessed in relation to the second curved wall.

Air impeding structures with snap-in tabs

In example implementations, a memory cooler is provided. The memory cooler includes a body. The body includes two pieces that are moveable relative to one another. Each piece of the body includes an inlet manifold, an outlet manifold, and a plurality of cold plates extending between the inlet manifold and the outlet manifold. The inlet manifold is to receive liquid coolant from a liquid coolant supply line. The outlet manifold is to return the liquid coolant to the liquid coolant supply line. The liquid coolant flows from the inlet manifold to the outlet manifold through interior channels of the cold plates. The plurality of cold plates of a first piece of the body are interleaved with the plurality of cold plates of a second piece of the body such that slots to receive memory modules are defined between adjacent pairs of cold plates.

Memory coolers

A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.

Liquid-cooled integrated circuit system

Examples described herein include socket covers with air impeding structures. In some examples, a processing unit socket cover comprises a base, an air impeding structure, and an engagement latch. The base may have a surface facing away from the socket and a perimeter defined by the surface. The air impeding structure may protrude from the surface and extend from a first side of the perimeter to a second side of the perimeter, diving the surface. The engagement latch may be connected to the air impeding structure to attach to the socket.

Socket covers with air impeding structures

A top loading cartridge is provided herein. The top loading cartridge includes a support member and a lock mechanism. The support member to receive an electronic component. The lock mechanism includes a handle and an engagement member. The handle to connect to the support member and move between a first position and a second position. The engagement member to extend from the support member to engage with a chassis.

Top loading cartridge

A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.

Controlling impedance of blank cartridges

Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.

Growing community of inventors

Houston, TX, United States of America

Pinche Tsai