This inventor holds 2 USPTO granted patents. Top assignee: Nxp B.v.. Active years: 2013-2014.
Company Filing History:
Years Active: 2013-2014
Title: Pieter Hochstenbach: Innovator in Chip Scale Packaging
Introduction
Pieter Hochstenbach is a notable inventor based in Nijmegen, Netherlands. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
Hochstenbach's latest patents include advancements in fan-out chip scale packaging. His first patent describes a chip scale package that features a semiconductor die with an array of die bond pads. These pads are arranged with a bond pad density per unit area and are embedded in a molded die support body. This body has a surface that supports an array of conducting contacts, with each contact connected by an electrical lead to a corresponding die bond pad. The second patent mirrors this innovation, emphasizing the importance of efficient design in semiconductor technology.
Career Highlights
Pieter Hochstenbach is currently employed at NXP B.V., a leading company in the semiconductor industry. His work focuses on enhancing the performance and reliability of chip scale packages, which are crucial for modern electronic devices.
Collaborations
Hochstenbach collaborates with talented professionals in his field, including Leo Van Gemert and Jan Gulpen. Their combined expertise contributes to the innovative projects at NXP B.V.
Conclusion
Pieter Hochstenbach's contributions to chip scale packaging reflect his dedication to advancing semiconductor technology. His patents and collaborations highlight his role as a key innovator in the industry.