The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Jun. 12, 2013
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Jan Gulpen, Nijmegen, NL;
Tonny Kamphuis, Lent, NL;
Pieter Hochstenbach, Nijmegen, NL;
Leo Van Gemert, Nijmegen, NL;
Eric Van Grunsven, Someren, NL;
Marc De Samber, Lommel, BE;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.