This inventor holds 2 USPTO granted patents. Top assignee: Nxp B.v.. Active years: 2013-2014.
Company Filing History:
Years Active: 2013-2014
Title: Eric Van Grunsven: Innovator in Chip Scale Packaging
Introduction
Eric Van Grunsven is a notable inventor based in Someren, Netherlands. He has made significant contributions to the field of semiconductor technology, particularly in chip scale packaging. With a total of 2 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
Eric's latest patents include innovative designs for fan-out chip scale packages. These packages feature a semiconductor die with an array of die bond pads arranged with a bond pad density per unit area. The die is embedded in a molded die support body that has a surface supporting an array of conducting contacts. Each contact is connected by an electrical lead to a corresponding die bond pad, enhancing the efficiency and performance of semiconductor devices.
Career Highlights
Throughout his career, Eric has been associated with NXP B.V., a leading company in the semiconductor industry. His expertise in chip scale packaging has positioned him as a key player in the development of advanced semiconductor solutions.
Collaborations
Eric has collaborated with talented individuals such as Tonny Kamphuis and Pieter Hochstenbach. These partnerships have fostered innovation and contributed to the success of their projects.
Conclusion
Eric Van Grunsven's contributions to chip scale packaging exemplify his dedication to innovation in the semiconductor field. His patents and collaborations reflect his commitment to advancing technology and improving product performance.