Granby, Canada

Pierre M Langevin

This inventor holds 6 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2004-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pierre M Langevin. Retrieved from https://idiyas.com/inventor/pierre-m-langevin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 2004-2008

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6 patents (USPTO):Explore Patents

Title: Pierre M Langevin: Innovator in Electronic Fabrication

Introduction

Pierre M Langevin is a notable inventor based in Granby, Canada. He has made significant contributions to the field of electronic fabrication, holding a total of 6 patents. His work focuses on innovative methodologies that enhance the efficiency and reliability of electronic devices.

Latest Patents

One of Langevin's latest patents is the "SMT passive device noflow underfill methodology and structure." This invention provides an electronic fabrication process for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. The process involves dispensing a liquid noflow resin encapsulant containing flux material between presoldered pads on a substrate. The SMD is then pressed into the encapsulant, allowing its electrical contacts to make contact with the presoldered pads. Heat is applied to activate the flux material and reflow the solder, bonding the SMD contacts to the pads. The resin encapsulant solidifies, filling the space between the substrate and SMD, and forming fillets around the solder bonded contacts.

Another significant patent by Langevin is focused on extending the fatigue life for C4 solder ball to chip connections. This method and structure couple a semiconductor substrate to an organic substrate, interfacing a solder member to conductive pads on both substrates. By optimizing the surface area of the pads and the distance from the centerline of the solder member to the lateral edge of the semiconductor substrate, thermal strains during thermal cycling can be reduced.

Career Highlights

Pierre M Langevin is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of electronic fabrication. His work has been instrumental in developing advanced methodologies that improve the performance and longevity of electronic components.

Collaborations

Langevin has collaborated with notable coworkers, including Son K Tran and Michael B Vincent. Their combined expertise has contributed to the successful development of innovative technologies in the electronic fabrication industry.

Conclusion

Pierre M Langevin is a distinguished inventor whose contributions to electronic fabrication have led to significant advancements in the field. His innovative patents and collaborative efforts continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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