Pieramedeo Bozzini

Title: Pieramedeo Bozzini: Innovator in Integrated Power Device Technology

Introduction

Pieramedeo Bozzini is a notable inventor based in Sedriano, Italy. He has made significant contributions to the field of integrated power devices through his innovative designs and patents. His work focuses on improving the efficiency and functionality of electronic components.

Latest Patents

One of Pieramedeo Bozzini's key patents is titled "Leadframe with heat dissipator connected to S-shaped fingers." This invention presents an improved leadframe for packages of integrated power devices. The design allows for the effective pressing of the dissipator against the bottom of the shell during the molding of the plastic case. This is achieved without exposing portions of the inner face of the dissipator that contacts the chip. The leadframe comprises a monolithic body that defines a perimetric frame, leads, and the dissipator. The dissipator is positioned in a depressed plane relative to the frame and is connected at three step-like points that are mutually spaced and non-aligned. This configuration ensures that pressure exerted on the frame is transmitted to the dissipator, allowing it to be pressed flat against the mold bottom without the need for pushers.

Career Highlights

Pieramedeo Bozzini is associated with Sgs-Thomson Microelectronics S.r.l., where he has contributed to advancements in electronic component design. His innovative approach has led to the development of technologies that enhance the performance of integrated power devices.

Collaborations

Pieramedeo has worked alongside his coworker, Giuseppe Marchisi, contributing to various projects that aim to push the boundaries of technology in their field.

Conclusion

Pieramedeo Bozzini's contributions to the field of integrated power devices through his innovative patents highlight his role as a significant inventor. His work continues to influence the development of more efficient electronic components.