The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 1992

Filed:

Feb. 19, 1991
Applicant:
Inventors:

Pieramedeo Bozzini, Sedriano, IT;

Giuseppe Marchisi, Milan, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 81 ;
Abstract

An improved leadframe for packages of integrated power devices which, by virtue of its configuration, allows to press the dissipator on the bottom of the shell during the molding of the plastic case, without the dissipator having exposed portions of its inner face (which is in contact with the chip). In order to achieve this, the leadframe according to the invention comprises a monolithic body which defines a perimetric frame, the leads and the dissipator. The dissipator extends in a depressed plane with respect to the frame and is connected to the frame and to the leads in at least three step-like points which are mutually spaced and non-aligned. During the molding of the plastic case, a pressure is exerted on the frame and is transmitted to the dissipator by the three step-like points, so that the dissipator is effectively pressed flat against the bottom of the mold without using pushers which pass through the plastic case.


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