This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2004-2005.
Company Filing History:
Years Active: 2004-2005
Title: The Innovations of Phillip H Chen
Introduction
Phillip H Chen is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of electronic assembly, particularly in the design of heat sinks and package surfaces. With a total of 2 patents, his work has had a considerable impact on improving thermal conductivity in electronic devices.
Latest Patents
Phillip's latest patents focus on an electronic assembly that includes a heat sink, a thermal interface material, an integrated circuit, and a package connected to the integrated circuit. The thermal interface material is strategically positioned between a first surface on the package and a second surface on the heat sink to enhance thermal conductivity. Notably, at least one of the surfaces features either a cavity that traps excess thermal interface material when the heat sink is compressed against the package or a protrusion that maintains bond line thickness between the heat sink and package.
Career Highlights
Phillip H Chen is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has allowed him to collaborate with other talented professionals in the field, further advancing the company's mission to lead in technology.
Collaborations
Phillip has worked closely with his coworker, Seri Lee, on various projects that aim to enhance the efficiency and performance of electronic assemblies.
Conclusion
Phillip H Chen's contributions to the field of electronic assembly through his innovative patents demonstrate his commitment to advancing technology. His work not only improves product performance but also sets a standard for future innovations in the industry.