Phillip Friddle

Title: The Innovations of Phillip Friddle

Introduction

Phillip Friddle is an accomplished inventor based in Clifton Park, NY (US). He holds two patents that showcase his expertise in semiconductor technology. His work has significantly contributed to advancements in the field of patterning and etching processes.

Latest Patents

Friddle's latest patents include a multi-layer hardmask for defect reduction in extreme ultraviolet (EUV) patterning. This invention involves methods, apparatus, and systems that utilize a multi-layer hardmask to enhance the patterning of semiconductor substrates. The hardmask consists of an upper layer made from a metal-containing material and a lower layer composed of an inorganic dielectric silicon-containing material. This innovative design provides excellent etch selectivity and minimizes defects such as microbridges and line breaks. Another notable patent is the polymerization protective liner for reactive ion etch in patterning. This method involves using a polymerization protective liner after forming a lower patterned mask layer, which is essential for etching trenches on a semiconductor substrate.

Career Highlights

Phillip Friddle has worked with prominent companies in the technology sector, including Lam Research Corporation and International Business Machines Corporation (IBM). His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Friddle has collaborated with talented individuals such as Bhaskar Nagabhirava and Dominik Metzler. These partnerships have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Phillip Friddle's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative approaches continue to influence the development of advanced patterning techniques.