Philip William Seitzer

Title: The Innovations of Philip William Seitzer

Introduction

Philip William Seitzer is a notable inventor based in Bethlehem, PA (US). He holds a total of 6 patents that showcase his contributions to the field of semiconductor technology. His work has significantly impacted the design and testing of integrated circuits.

Latest Patents

Seitzer's latest patents include a "Reinforced bond pad for a semiconductor device." This invention introduces novel support structures for pad reinforcement, along with new bond pad designs that address issues related to probe testing. By separating the probe region from the wire bond region, his designs prevent damage during testing, leading to more reliable wire bonds. Additionally, forming the bond pad over active circuitry allows for a more compact integrated circuit design. Another significant patent is the "Method of electrical testing of an integrated circuit with an electrical probe." This method involves applying a material with specific bulk resistivity and viscosity to either the device or the probe, which has been shown to reduce the need for cleaning the probe significantly.

Career Highlights

Throughout his career, Seitzer has worked with prominent companies such as Agere Systems Inc. and Western Electric Company, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Seitzer has collaborated with notable coworkers, including Joel R. Bitler and Michael W. Bodnar. Their combined efforts have further advanced the field of semiconductor design and testing.

Conclusion

Philip William Seitzer's contributions to semiconductor technology through his patents and career experiences highlight his role as an influential inventor. His innovative designs and methods continue to shape the industry, ensuring more reliable and efficient integrated circuits.